Huawei's presentation at IEEE ISCAS outlined a shift from geometric scaling under Moore's Law to time-based Tau scaling via LogicFolding, targeting 1.4 nm production by 2031 through reduced signal propagation delay rather than reliance on extreme ultraviolet lithography. This approach directly engages the parameters of US Bureau of Industry and Security rules updated in October 2023 that restrict advanced-node equipment exports to China. Primary BIS documentation emphasizes controls on specific deposition and etching tools, yet Huawei's method prioritizes architectural compression over those restricted processes. SMIC's subsequent share movement reflects market pricing of reduced near-term dependence on ASML and Applied Materials equipment. Taiwanese regulatory filings from TSMC continue to project 1.4 nm volume in 2028, establishing a timeline gap that Chinese state media interpret as narrowing while US policy statements frame as sustainable. The episode underscores how domestic architectural innovation can interact with layered licensing requirements without violating the explicit equipment prohibitions listed in the EAR. Multiple official channels, including the Entity List and validated end-user provisions, remain the operative constraints rather than any single technical threshold.