Hyperscalers' demand for high-bandwidth memory is constraining AI accelerator production and rippling through global semiconductor supply chains. IEEE Spectrum's February 2025 reporting on the HBM shortage driven by Nvidia GB200 and AMD Instinct demand cites Micron, Samsung, and SK Hynix capacity data but understates how HBM3E stacking yields remain below 60% per VLSI Research Q1 2025, a figure that delayed volume shipments by two quarters compared to initial projections. The coverage also does not connect this to the 2021-2022 automotive DRAM shortage documented by Bloomberg, which similarly originated from three-supplier concentration and took 18 months to ease. SK Hynix holds approximately 50% HBM market share according to TrendForce's March 2025 update, with new production lines in South Korea and the United States competing for the same advanced packaging tools used in CoWoS and EMIB interposers supplied primarily by TSMC. Goldman Sachs' April 2025 note on AI infrastructure states data-center power demand could reach 8% of U.S. generation by 2030, directly tying HBM-limited GPU clusters to grid upgrade backlogs in Virginia and Texas already reported by the EIA. Synthesizing Micron's fiscal Q1 2025 earnings call with IEA world energy outlook data shows HBM supply is fully booked through 2026, forcing hyperscalers to consider lower-bandwidth alternatives that reduce training throughput by up to 30%, a physical limit rarely linked in coverage to downstream effects on consumer device pricing or U.S.-China technology export controls.